• DocumentCode
    3295177
  • Title

    Evolutionary Engineering Collaboration for DFM/DFY Solutions between Foundry and EDA Tool Vendor

  • Author

    Su, Yea-Huey ; Guo, Ruey-Shan ; Chang, Hsiao-Huan

  • Author_Institution
    Nat. Central Univ., Chungli
  • fYear
    2006
  • fDate
    25-27 Sept. 2006
  • Firstpage
    475
  • Lastpage
    478
  • Abstract
    With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.
  • Keywords
    design for manufacture; foundries; integrated circuit yield; time to market; collaboration activities; deep-submicron technology; evolutionary engineering collaboration; foundries; input-output coordination; know-how creation; know-how sharing; post-design manufacturing stage; time-to-market; Collaboration; Collaborative tools; Design for manufacture; Electronic design automation and methodology; Foundries; Information management; Lead; Magnetic force microscopy; Manufacturing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    978-4-9904138-0-4
  • Type

    conf

  • DOI
    10.1109/ISSM.2006.4493140
  • Filename
    4493140