DocumentCode
3295177
Title
Evolutionary Engineering Collaboration for DFM/DFY Solutions between Foundry and EDA Tool Vendor
Author
Su, Yea-Huey ; Guo, Ruey-Shan ; Chang, Hsiao-Huan
Author_Institution
Nat. Central Univ., Chungli
fYear
2006
fDate
25-27 Sept. 2006
Firstpage
475
Lastpage
478
Abstract
With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.
Keywords
design for manufacture; foundries; integrated circuit yield; time to market; collaboration activities; deep-submicron technology; evolutionary engineering collaboration; foundries; input-output coordination; know-how creation; know-how sharing; post-design manufacturing stage; time-to-market; Collaboration; Collaborative tools; Design for manufacture; Electronic design automation and methodology; Foundries; Information management; Lead; Magnetic force microscopy; Manufacturing; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2006. ISSM 2006. IEEE International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
978-4-9904138-0-4
Type
conf
DOI
10.1109/ISSM.2006.4493140
Filename
4493140
Link To Document