• DocumentCode
    3295710
  • Title

    Physical failure analysis of package qualification for new product and process

  • Author

    Lin, Yi-Chen ; Chang, Hung-Jia

  • Author_Institution
    Quality Div., Powerchip Semicond. Corp., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    5-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In the studies, we investigate the cause of failure that occur during pilot run and new process evaluation. The results are fed back to wafer and assembly design and process improvement. From our results, the evaluation for package qualification can find out not only package but also wafer process issue.
  • Keywords
    DRAM chips; ball grid arrays; failure analysis; DRAM product; assembly design; dynamic random access memory; package qualification evaluation; physical failure analysis; wafer process evaluation; window ball grid array; Aluminum; Assembly; Corrosion; Failure analysis; Humidity; Qualifications; Semiconductor device packaging; Stress; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4244-5596-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2010.5531977
  • Filename
    5531977
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3295710