Patterning and electrical testing of field emission arrays with novel emitter geometries

Fabrication technology for Cu microtips with high aspect ratio, where microtip height is ~6.5-7.5 μm and microtip density in the active area is ~2.88×10⁶ tips/cm², via lift-off method is experimentally confirmed. We investigated the possibility of increasing emission uniformity though the introduction of a-Si multi-resistors into the microtips. We establish that reduction of fluctuation currents can be achieved with 300-350 A thick SiC coating over the microtips. We looked into emission properties of Cu microtips with dome-shaped Ti apex