Delay and Crosstalk on Future 32 nm Node Interconnects: Impact of ULK-Air-Gap Architecture

Author

Blampey, B. ; Gallitre, M. ; Fléchet, B. ; Farcy, A. ; Gosset, L.G. ; Bermond, C. ; Cueto, O. ; Torres, J.

Author_Institution

LAHC, Savoie Univ., Chambery

fYear

2006

fDate

9-12 May 2006

Firstpage

75

Lastpage

78

Abstract

With technological developments towards 32 nm node ICs, interconnects effects have become fundamental on integrated circuits performances. Signal propagation will in particular be affected by complexity of technological stacks. In order to face integration and performance issues, air gap architecture constitutes a potential alternative to porous dielectric materials. After showing that air gap addresses the challenges on delay time for considered node, dimension effects corresponding to several kinds of applications will be analyzed in order to extract limits of integration regarding time-domain performances in terms of delay and crosstalk

Keywords

air gaps; crosstalk; delays; dielectric materials; integrated circuit interconnections; nanoelectronics; 32 nm; IC; ULK-air-gap architecture; crosstalk; delay; integrated circuits; node interconnects; signal propagation; Air gaps; Crosstalk; Delay effects; Dielectric materials; Frequency; Inorganic materials; Integrated circuit interconnections; Integrated circuit technology; Performance evaluation; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2006. IEEE Workshop on

Conference_Location

Berlin, Germany

Print_ISBN

1-4244-0455-x

Electronic_ISBN

1-4244-0455-x

Type

conf

DOI

10.1109/SPI.2006.289195

Filename

4069410