• DocumentCode
    3297393
  • Title

    SPI Proceedings: Analysis of High-Speed Digital Interfaces in Flexible Interconnections

  • Author

    Kotiranta, Pia ; Kelander, Llkka ; Rouvala, Markku

  • Author_Institution
    Nokia Research Center, Itÿmerenkatu 11-13, FIN-00045 Nokia Group, E-mail: pia.kotiranta@nokia.com
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    For mobile device applications, the performance of data interconnections has been getting into focus only lately. Requirements for higher performance devices and product miniaturization have been challenging the design of high-speed interconnections, driving the accurate and fast modeling of interconnect circuits. Here the maximum usable data rate analysis of a high-speed serial, camera- and display-like interface on a specific interconnection template is presented. Multiple modelling methods are combined to construct a flexible interconnection concept with various components. The effect of coupled antenna interference on the interconnection signal quality is included in the study.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2006. IEEE Workshop on
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    1-4244-0455-x
  • Electronic_ISBN
    1-4244-0455-x
  • Type

    conf

  • DOI
    10.1109/SPI.2006.289230
  • Filename
    4069465