• DocumentCode
    3302319
  • Title

    Optical interconnects to silicon CMOS

  • Author

    Miller, D.A.B.

  • Author_Institution
    Edward L. Ginzton Lab., Stanford Univ., CA, USA
  • fYear
    2001
  • fDate
    25-27 June 2001
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    There are even greater problems for off-chip interconnects than on-chip ones. It is possible to break long on-chip interconnects up using on-chip repeater amplifiers, but that approach is very inconvenient off of the chip. Consequently, off-chip interconnects are a particularly attractive first implementation of optical interconnects to silicon chips. Optical interconnects are interesting for many reasons other than this scaling argument. They are immune to electromagnetic interference and crosstalk, they provide voltage isolation, they can have very low loss, and. they allow use of free-space optics, imaging many light beams from one chip to another. Historically a great impediment to integrating optical interconnects with CMOS was the absence of suitable optical output devices. Fortunately there are now two devices that may be able to fill this role - quantum-well modulator diodes, and vertical cavity surface emitting lasers (VCSELs).
  • Keywords
    CMOS integrated circuits; crosstalk; optical interconnections; optical losses; packaging; quantum well lasers; surface emitting lasers; CMOS; crosstalk; electromagnetic interference immunity; free-space optics; loss; off-chip interconnects; optical interconnects; optical output devices; quantum-well modulator diodes; scaling; vertical cavity surface emitting lasers; voltage isolation; Electromagnetic interference; Optical amplifiers; Optical crosstalk; Optical devices; Optical interconnections; Optical modulation; Repeaters; Silicon; Stimulated emission; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2001
  • Conference_Location
    Notre Dame, IN, USA
  • Print_ISBN
    0-7803-7014-7
  • Type

    conf

  • DOI
    10.1109/DRC.2001.937861
  • Filename
    937861