3D Multilayer Integration and Packaging on Organic/Paper Low-cost Substrates for RF and Wireless Applications

Author

Yang, Li ; Tentzeris, Manos M.

Author_Institution

Georgia Inst. of Technol., Atlanta

fYear

2007

fDate

July 30 2007-Aug. 2 2007

Firstpage

267

Lastpage

270

Abstract

In this paper, solutions for developing low-cost 3D multilayer integration and packaging on the organic substrate liquid crystal polymer (LCP) and the paper substrate have been presented. The key components in RF wireless applications, namely dual band filters, dual-frequency/dual-polarization microstrip antenna arrays and an RFID tag have been designed and fabricated. Test results of the structures show good agreement between the simulation and measurement over their respective bandwidths, demonstrating stable performance of the organic/paper substrates.

Keywords

liquid crystal polymers; microstrip antenna arrays; multilayers; packaging; paper; radiofrequency filters; radiofrequency identification; radiofrequency integrated circuits; substrates; RFID tag; dual band filters; dual-frequency antenna arrays; dual-polarization antenna arrays; liquid crystal polymer; low-cost substrates; microstrip antenna arrays; multilayer integration; organic substrates; packaging; paper substrates; radiofrequency applications; wireless applications; Antenna accessories; Dual band; Liquid crystal polymers; Microstrip antenna arrays; Microstrip antennas; Microstrip components; Microstrip filters; Nonhomogeneous media; Packaging; Radio frequency; Dual-band antenna; RF and mm-waves front-end module; RFID; dual-band filter; inkjet-printing; liquid crystal polymer (LCP); multilayer modules; system-on-package (SOP); three-dimensional (3D) integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

1-4244-1448-2

Electronic_ISBN

1-4244-1449-0

Type

conf

DOI

10.1109/ISSSE.2007.4294464

Filename

4294464