DocumentCode
3306103
Title
Efficient Modeling of Packaging for Silicon-Base Inductor and MIM Capacitor
Author
Hsu, Chia-Wei ; Wu, Sung-Mao ; Yeh, Wen-Kuan ; Li, Mark
Author_Institution
Nat. Univ. of Kaohsiung, Kaohsiung
fYear
2007
fDate
July 30 2007-Aug. 2 2007
Firstpage
555
Lastpage
555
Abstract
Summary form only given. Equivalent model before and after packaging of integrate passive components, including spiral inductors and Metal-Insulator-Metal capacitors, are presented in this paper. Methods of conventional pi model as well as electrical parameters extracting by VNA measurement are also shown. The impact of packaging on high frequency performance and quality factor of integrated passive component before and after packaging has been investigated.
Keywords
MIM devices; Q-factor; capacitors; electronics packaging; elemental semiconductors; inductors; passive networks; silicon; MIM capacitor; Si; VNA measurement; electrical parameters; integrated passive components quality factor; silicon base inductor; spiral inductors; Electric variables measurement; Frequency; Inductors; MIM capacitors; Q factor; Research and development; Semiconductor device packaging; Spirals; Flip-chip; capacitor model; inductor model; quality factor;
fLanguage
English
Publisher
ieee
Conference_Titel
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location
Montreal, Que.
Print_ISBN
1-4244-1448-2
Electronic_ISBN
1-4244-1449-0
Type
conf
DOI
10.1109/ISSSE.2007.4294536
Filename
4294536
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