Heat Transfer Performance of Micro Heat Pipe with Trapezium-grooved Wick

With the infinite yearning for product performances in microelectronics and chemicals, increasing integration level of microelectronic products has brought the fatal problem of heat dissipation. In order to meet high-power chips´ heat dissipation, in this paper, micro heat pipe with trapezium-grooved wick was digitally described first, then mathematical models were established for theoretical analysis, and finally experiments were conducted on micro heat-pipes of different groove structures manufactured by high speed spinning. The results shows, first, a micro heat pipe with trapezium-grooved wick has fairly good warm start performance, second, its inclination angle greatly influences heat transfer performance, third, better heat transfer performances can be obtained when the ratio of the groove´s width to its wall thickness is 1:1 and that of the groove´s depth to its width is 1.5:1; fourth, its thermal conductivity can be 100 times that of red copper.