• DocumentCode
    330719
  • Title

    Effects Of Post Annealing And Oxidation Processes On The Removal Of Damage Generated During The Shallow Trench Etch Process

  • Author

    Lee, Y.L. ; Hwang, S.W. ; Lee, J.W. ; Lee, J.Y. ; Yeom, G.Y.

  • Author_Institution
    Sung Kyun Kwan University
  • fYear
    1998
  • fDate
    13-16 July 1998
  • Firstpage
    228
  • Lastpage
    230
  • Keywords
    Annealing; Capacitance measurement; Capacitance-voltage characteristics; Couplings; Electric variables measurement; Etching; Oxidation; Plasma applications; Schottky diodes; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology Conference, 1998 International
  • Conference_Location
    Kyoungju, South Korea
  • Print_ISBN
    4-930813-83-2
  • Type

    conf

  • DOI
    10.1109/IMNC.1998.730057
  • Filename
    730057
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=330719