Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

Author

Dumitrescu, Marius ; Cobianu, Cornel ; Lungu, Dan ; Dascalu, Dan ; Pascu, Adrian ; Kolev, Spas ; van den Berg, Albert

Author_Institution

Inst. of Microtechnol., Bucharest, Romania

Volume

1

fYear

1998

fDate

6-10 Oct 1998

Firstpage

83

Abstract

A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element “COSMOS” program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimised lay-out based on four “poly” suspended bridges and a central “poly” pillar supporting the 110×110 μm “poly” membrane separated from the silicon substrate by 1 μm of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW

Keywords

electric heating; elemental semiconductors; finite element analysis; gas sensors; low-power electronics; membranes; micromachining; microsensors; silicon; 100 mW; 3D finite element program; 673 K; COSMOS; Si; gas sensor; low power operation; micro hot plate; polysilicon membrane; surface micromachining; thermal simulation; Biomembranes; Bridges; Energy consumption; Geometry; Microstructure; Packaging; Silicon; Solids; Temperature sensors; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International

Conference_Location

Sinaia

Print_ISBN

0-7803-4432-4

Type

conf

DOI

10.1109/SMICND.1998.732287

Filename

732287