DocumentCode
331015
Title
Glass passivated chip-early reliability test
Author
Bucheru, B.T. ; Turtudau, F. ; Ichim, Any ; Iosif, R. ; Marinescu, V.A.
Author_Institution
S.C. Baneasa S.A., Bucharest, Romania
Volume
1
fYear
1998
fDate
6-10 Oct 1998
Firstpage
255
Abstract
The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations)
Keywords
automotive electronics; passivation; power semiconductor diodes; semiconductor device reliability; semiconductor device testing; solid-state rectifiers; DO21; automotive rectifier diode; chip fabrication; glass passivation; pressure resistance; rapid thermal variations; reliability test; Assembly; Automotive engineering; Glass; Performance evaluation; Semiconductor device manufacture; Semiconductor diodes; Silicon; Stress; Testing; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location
Sinaia
Print_ISBN
0-7803-4432-4
Type
conf
DOI
10.1109/SMICND.1998.732364
Filename
732364
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