DocumentCode
3318093
Title
Power dissipation considerations in low side switch design
Author
Danchiv, Andrei ; Hulub, Marian ; Manta, Diana
Author_Institution
Infineon Technol. Romania, Bucharest, Romania
Volume
02
fYear
2010
fDate
11-13 Oct. 2010
Firstpage
431
Lastpage
434
Abstract
This paper presents a fully protected low side switch design from the thermal behavior perspective. The power dissipation is evaluated both for normal operation and for the main high power operation conditions: short circuit and overload, inductive clamping and turn on/off process. Electro-thermal simulations are used to evaluate the surface temperature, that is taken into account in designing the protection functions.
Keywords
switches; electrothermal simulations; inductive clamping; low side switch design; power dissipation; protection functions; short circuit; surface temperature; thermal behavior; turn on-off process; Clamps; Inductors; Power dissipation; Surge protection; Surges; Switches; Switching circuits; power dissipation; thermal simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2010 International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-4244-5783-0
Type
conf
DOI
10.1109/SMICND.2010.5650563
Filename
5650563
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