DocumentCode
3319866
Title
Proceedings of the 4th International Symposium on Electronic Materials and Packaging (Cat. No.02EX634)
fYear
2002
fDate
4-6 Dec. 2002
Keywords
ceramic packaging; circuit simulation; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; interconnections; materials testing; reliability; semiconductor device models; semiconductor device packaging; soldering; surface mount technology; thermal management (packaging); LTCC; SMT; electronic materials; electronic packaging; embedded components; interconnect technologies; low temperature cofired ceramics; materials characterization; measurement; modeling; packaging reliability; simulation; solders; testing; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Conference_Location
Kaohsiung, Taiwan
Print_ISBN
0-7803-7682-X
Type
conf
DOI
10.1109/EMAP.2002.1188804
Filename
1188804
Link To Document