Packaging and thermal analysis of a power inverter for inductive heating applications

Author

Man, Lucian ; Pop, Ovidiu ; Tâut, Adrian

Author_Institution

Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania

fYear

2010

fDate

23-26 Sept. 2010

Firstpage

279

Lastpage

282

Abstract

The Intermediate Data Format (IDF) is a specification designed to provide a neutral representation for exchanging printed circuit assembly (PCA) data among mechanical design (MCAD), PCA layout (ECAD), and physical design analysis (MCAE) applications. The paper presents a combined analysis for a power inverter for induction heating applications. The inverter is also studied via a comprehensive analysis with operation equations of the circuit. An alternative to the use of circuit-oriented simulators for study of these circuits operating is to describe the circuit and the controller by means of differential and algebraic equations.

Keywords

invertors; printed circuit layout; thermal analysis; PCA layout; inductive heating; intermediate data format; mechanical design; neutral representation; packaging analysis; power inverter; printed circuit assembly data; thermal analysis; Design automation; Electronic packaging thermal management; Heat transfer; Integrated circuit modeling; Inverters; Solid modeling; Thermal analysis; CAD; IDF; MCAD; Matlab; thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for

Conference_Location

Pitesti

Print_ISBN

978-1-4244-8123-1

Type

conf

DOI

10.1109/SIITME.2010.5650842

Filename

5650842