• DocumentCode
    332549
  • Title

    Microfabricated thin-film physical sensors for hostile environment

  • Author

    Lei, Jih-Fen ; Will, Herbert A. ; Martin, Lisa C.

  • Author_Institution
    NASA Lewis Res. Center, Cleveland, OH, USA
  • Volume
    1
  • fYear
    1998
  • fDate
    31 Oct-7 Nov 1998
  • Abstract
    Advanced microfabricated thin film sensors are being developed to provide accurate temperature, heat flux and strain measurements for use in hostile propulsion environments. These sensors are sputter deposited and microfabricated directly onto the test articles with no additional bonding agent. The thickness of the sensors is only a few micrometers, which creates minimal disturbance of the gas flow over the test surface. Thus thin film sensors have the advantage over conventional wire-based sensors by providing minimally intrusive measurement and having a faster response. These microfabricated thin film sensors are being developed for characterization of advanced materials and structures in hostile, high-temperature environments, and for validation of design codes. This paper presents the advances of microfabricated physical sensor technologies developed at NASA Lewis Research Center: thermocouples, heat-flux gages and resistance strain gages. The fabrication techniques of these thin film sensors are described. Sensor demonstrations on a variety of engine materials in several hostile, high-temperature test environments are presented. The advantages and limitations of thin film sensor technology are also discussed
  • Keywords
    aerospace instrumentation; aerospace propulsion; microsensors; strain gauges; temperature sensors; thermocouples; gas flow; heat flux measurement; heat-flux gages; high-temperature environments; hostile propulsion environments; microfabricated sensors; resistance strain gages; sputter deposition; strain measurement; temperature measurement; thermocouples; thin-film physical sensors; Bonding; Gas detectors; Propulsion; Sensor phenomena and characterization; Space technology; Sputtering; Strain measurement; Temperature sensors; Testing; Thin film sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital Avionics Systems Conference, 1998. Proceedings., 17th DASC. The AIAA/IEEE/SAE
  • Conference_Location
    Bellevue, WA
  • Print_ISBN
    0-7803-5086-3
  • Type

    conf

  • DOI
    10.1109/DASC.1998.741505
  • Filename
    741505