• DocumentCode
    33255
  • Title

    Compositional Performance Verification of Network-on-Chip Designs

  • Author

    Holcomb, Daniel E. ; Seshia, Sanjit A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, Berkeley, CA, USA
  • Volume
    33
  • Issue
    9
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    1370
  • Lastpage
    1383
  • Abstract
    This paper presents a compositional approach to formally verify quality-of-service properties of network-on-chip designs. A major challenge to scalability is the need to verify worst-case latency bounds for hundreds to thousands of cycles, which are beyond the capacity of state-of-the-art model checkers. The scalability challenge is addressed using a compositional model checking approach. The overall latency bound problem is divided into a number of smaller sub-problems, termed latency lemmas. The sub-problems imply the overall latency bound, but are easier to prove on account of being inductive. A method is presented for computing these lemmas based on the topology of the network and a subset of relevant state, and the latency lemmas are verified using k-induction. The effectiveness of this compositional technique is demonstrated on illustrative examples and an industrial ring interconnection network. In the ring network, a latency bound that cannot be verified in 10 000 s without lemmas is proved inductively in just 75 s when the lemmas are used.
  • Keywords
    integrated circuit interconnections; network-on-chip; quality of service; compositional performance verification; industrial ring interconnection network; k-induction; latency lemmas; network-on-chip designs; overall latency bound problem; quality-of-service properties; Microarchitecture; Model checking; Network topology; Network-on-chip; Quality of service; Topology; Upper bound; On-chip networks; quality-of-service; verification;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2014.2331342
  • Filename
    6879626