• DocumentCode
    3326063
  • Title

    Design of wideband LC balun embedded into organic substrate using coupled LC resonators

  • Author

    Park, Jong C. ; Park, Jae Y.

  • Author_Institution
    Dept. of Electron. Eng., Kwangwoon Univ., Seoul
  • fYear
    2007
  • fDate
    29-31 Dec. 2007
  • Firstpage
    85
  • Lastpage
    88
  • Abstract
    In this paper, wideband LC balun using coupled LC resonator has been designed, simulated and fabricated for being embedded into an organic packaging substrate. The proposed balun has a novel scheme which consists of two pair of coupled embedded LC resonators which share one resonator with each other. The coupled resonators are applied to obtain a precise phase difference of 180 degree and an identical magnitude between two balanced ports. This proposed balun has relatively small inductance and capacitance values which can be easily embedded into the organic packaging substrate. The capacitors at embedded LC resonators were realized by using high dielectric BTO composite film. The measured result shows that fabricated balun has excellent phase and magnitude imbalanced characteristic. The measured results are an insertion loss of 1.8 dB, a return loss of 10 dB, a phase imbalance of 0.5 degree and magnitude imbalance of 0.7 dB at frequency bandwidth of 700 MHz ranged from 1.8 GHz to 2.5 GHz, respectively. The fabricated balun has a volume of 2 mm x 3.5 mm x 0.66 mm (height). The measured result was well agreed with the simulated results.
  • Keywords
    UHF circuits; baluns; cavity resonators; composite materials; coupled circuits; dielectric thin films; electronics packaging; bandwidth 700 MHz; capacitors; coupled LC resonators; frequency 1.8 GHz to 2.5 GHz; high dielectric BTO composite film; loss 1.8 dB; loss 10 dB; organic packaging substrate; wideband LC balun; Capacitance; Capacitors; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Impedance matching; Inductance; Packaging; Phase measurement; Wideband; Coupled LC resonator; SOP; Wideband balun; capacitor; high dielectric composite; inductor; organic package substrate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2007. ICM 2007. Internatonal Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-4244-1846-6
  • Electronic_ISBN
    978-1-4244-1847-3
  • Type

    conf

  • DOI
    10.1109/ICM.2007.4497667
  • Filename
    4497667