• DocumentCode
    3326880
  • Title

    Empirical analysis of the supporting environment on the venture capital development role

  • Author

    Wan Kun-yang ; Yan, Yan

  • Author_Institution
    Econ. & Manage. Eng. Dept., Zhejiang Water Conservancy & Hydropower Coll., Hangzhou
  • fYear
    2008
  • fDate
    10-12 Sept. 2008
  • Firstpage
    1620
  • Lastpage
    1626
  • Abstract
    This paper uses the multiple regression analysis and the structural equation modeling (SEM) to study the relationship between venture capital and supporting environment. The empirical analysis results show that, the corporation leading science technology environment (CLSTE) and the government supportive policies synthesis level (GSPSL) have direct effects on the development of VC; the development level of economy (DLE) and the CLSTE, the development pattern of economy (DPE) and the GSPSL interact to promote the development of VC. Therefore, in order to develop VC, it must optimize the economic environment (EE), cultivate the CLSTE and perfect the GSPE.
  • Keywords
    economics; regression analysis; venture capital; corporation leading science technology environment; development level of economy; development pattern of economy; economic environment; government supportive policies synthesis level; multiple regression analysis; structural equation modeling; supporting environment; venture capital; Cities and towns; Conference management; Economic indicators; Environmental economics; Industrial economics; Local government; Regression analysis; Research and development; Venture capital; Virtual colonoscopy; multiple regression analysis; structural equation modeling; supporting environment; venture capital;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management Science and Engineering, 2008. ICMSE 2008. 15th Annual Conference Proceedings., International Conference on
  • Conference_Location
    Long Beach, CA
  • Print_ISBN
    978-1-4244-2387-3
  • Electronic_ISBN
    978-1-4244-2388-0
  • Type

    conf

  • DOI
    10.1109/ICMSE.2008.4669122
  • Filename
    4669122