• DocumentCode
    3328618
  • Title

    Semiconductor components and solid state switches for power modulator applications

  • Author

    Welleman, A. ; Ramezani, E. ; Waldmeyer, J.

  • Author_Institution
    Dept. of Semicond., ABB Switzerland Ltd., Lenzburg, Switzerland
  • fYear
    2002
  • fDate
    30 June-3 July 2002
  • Firstpage
    191
  • Lastpage
    194
  • Abstract
    An overview is given about semiconductor components and solid state switch assemblies for repetitive pulse applications. These switches are designed for use in power modulator applications. A newly developed switching system is presented which can be used up to 40 kVDC, current capabilities of several kA, and very high current rise rates which are also in the several kA/μs range. Pulse repetition frequencies up to 1 kHz are possible if the devices are combined with adequate cooling. The switches are designed as alternative, or replacement of thyratron and ignitron solutions because lifetime is several times better. By using a modular platform technology, a large variation of power levels can be reached. The presented switches include triggering system, and, where required, also include power supply and air or water cooled heatsinks.
  • Keywords
    cooling; modulators; power semiconductor switches; pulsed power supplies; pulsed power switches; 1 kHz; 40 kV; cooling; current capabilities; modular platform technology; power modulator; power modulator applications; power supply; repetitive pulse applications; semiconductor components; solid state switches; triggering system; very high current rise rates; water cooled heatsinks; Assembly; Cooling; Frequency; Heat sinks; Power semiconductor switches; Power supplies; Solid state circuits; Switching systems; Thyratrons; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Conference Record of the Twenty-Fifth International
  • ISSN
    1076-8467
  • Print_ISBN
    0-7803-7540-8
  • Type

    conf

  • DOI
    10.1109/MODSYM.2002.1189448
  • Filename
    1189448