DocumentCode
3330527
Title
Interconnects and packaging of millimeter wave circuits
Author
Menzel, Wolfgang
Author_Institution
Microwave Tech., Ulm Univ., Germany
fYear
1997
fDate
7-8 Jul 1997
Firstpage
55
Lastpage
58
Abstract
This paper presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different interconnects and two realized front-ends are demonstrated
Keywords
MIMIC; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; millimetre wave integrated circuits; EHF; MM-wave ICs; front-ends; hybrid circuits; interconnects; millimeter wave circuits; monolithic integrated circuits; packaging; waveguide circuits; Assembly; Conducting materials; Costs; Integrated circuit interconnections; Integrated circuit packaging; Millimeter wave circuits; Packaging machines; Semiconductor materials; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Millimeter Waves, 1997 Topical Symposium on
Conference_Location
Kanagawa
Print_ISBN
0-7803-3887-1
Type
conf
DOI
10.1109/TSMW.1997.702444
Filename
702444
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