• DocumentCode
    3335753
  • Title

    Progress in SiC and GaN microwave devices fabricated on semi-insulating 4H-SiC substrates

  • Author

    Palmour, J.W. ; Allen, S.T. ; Sheppard, S.T. ; Pribble, W.L. ; Sadler, R.A. ; Alcorn, T.S. ; Ring, Z. ; Carter, C.H., Jr.

  • Author_Institution
    Cree Res. Inc., Durham, NC, USA
  • fYear
    1999
  • fDate
    23-23 June 1999
  • Firstpage
    38
  • Lastpage
    41
  • Abstract
    The two technologies being studied are SiC MESFETs based on homoepitaxially grown epilayers, primarily targeted for applications from UHF up to 10 GHz, and GaN/AlGaN HEMTs that are grown via heteroepitaxial MOCVD which can operate at frequencies potentially up to 35 GHz. As a result of the use of 4H-SiC semi-insulating substrates, impressive demonstrations of microwave power have been made in both types of devices. This paper will describe progress made in SiC substrates, and some of the resulting microwave device demonstrations in both SiC MESFETs and in GaN/AlGaN devices grown on SiC.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; microwave field effect transistors; microwave power transistors; power HEMT; power MESFET; silicon compounds; substrates; wide band gap semiconductors; 10 GHz; 35 GHz; GaN; GaN/AlGaN HEMT; SiC; SiC MESFET; heteroepitaxial MOCVD layer; homoepitaxial layer; microwave power device; semi-insulating 4H-SiC substrate; wide bandgap material; Aluminum gallium nitride; Frequency; Gallium nitride; HEMTs; MESFETs; MOCVD; MODFETs; Microwave devices; Silicon carbide; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference Digest, 1999 57th Annual
  • Conference_Location
    Santa Barbara, CA, USA
  • Print_ISBN
    0-7803-5170-3
  • Type

    conf

  • DOI
    10.1109/DRC.1999.806315
  • Filename
    806315