• DocumentCode
    3336412
  • Title

    Development of Rapid Mask Fabrication Technology for Micro-Abrasive Machining

  • Author

    Lee, In Hwan ; Seung Pyo Lee ; Ko, Tae Jo ; Kang, Hyun Wook ; Cho, Dong-Woo

  • Author_Institution
    Sch. of Mech. Eng., Chungbuk Nat. Univ., Cheongju
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    Micro-abrasive jet machining (mu-AJM) has become a useful technique for micro-machining of a brittle material such as glass, silicon, etc. This technology is mainly based on the erosion of a mask which protects substrate against high velocity of micro-particles. Generally, for the fabrication of a mask in the mu-AJM process, a photomask based on the semi-conductor fabrication process was used. In this research, a rapid mask fabrication technology based on micro-stereolithography technology has been developed for the mu-AJM. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Si wafer were abrasive-jet machined using fabricated mask patterns.
  • Keywords
    brittleness; erosion; laser beam applications; masks; micromachining; semiconductor technology; silicon; stereolithography; substrates; Si wafer; UV laser beam; brittle material; microabrasive jet machining; micromask pattern; microstereolithography technology; photolithography process; photomask; rapid mask fabrication technology; semiconductor fabrication process; substrate protects; Commercialization; Fiber lasers; Laser beams; Lithography; Machining; Mechanical engineering; Optical device fabrication; Optical fibers; Protection; Substrates; mask; micro-abrasive jet machining; micro-stereolithography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
  • Conference_Location
    Gyeonggi-do
  • Print_ISBN
    978-89-950038-8-6
  • Electronic_ISBN
    978-89-962150-0-4
  • Type

    conf

  • DOI
    10.1109/ICSMA.2008.4505553
  • Filename
    4505553