• DocumentCode
    3336447
  • Title

    Experiment Study of Micro hot-embossing process using GC mold and PC substrate

  • Author

    Lan, Shuhuai ; Lee, Moongu ; Ni, Jun ; Moongu Lee ; Choi, Seogou

  • Author_Institution
    Dept. of Mech. Eng., Shanghai Jiao Tong Univ., Shanghai
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    377
  • Lastpage
    382
  • Abstract
    Micro semi-pyramidal pattern arrays were directly created on the commercially available polymer substrate (polycarbonate, PC) by pressing a glassy carbon (GC) mold in the hot-embossing process with self-made hot-embossing machine. The micro feature of negative cavity on the GC mold was fabricated by Focus Ion Beam technique (FIB). The cavities were approximately 65times70 um at width and 42 um at depth. The space periodicity between the micro cavities is about 120times120 um. By adopting an orthogonal design of experiment method with four parameters of the micro hot-embossing process, each one at three levels was studied. The key parameters which have important influence to the forming result, such as embossing force, embossing temperature, heating time and force holding time were studied. Good forming result was obtained by using a set of optimal parameters according to analysis of experiment data.
  • Keywords
    design of experiments; embossing; glass; heating; hot working; ion beam effects; micromechanics; moulding; polymers; pressing; production equipment; focus ion beam technique; force holding time; forming process; glassy carbon mold; heating time; hot-embossing machine; micro hot-embossing process; microsemipyramidal pattern arrays; orthogonal design of experiment method; polycarbonate substrate; pressing; Design methodology; Embossing; Heating; Ion beams; Manufacturing processes; Mechanical engineering; Nanobioscience; Optical device fabrication; Polymers; Temperature; Design of experiment method; GC mold; Micro hot-embossing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
  • Conference_Location
    Gyeonggi-do
  • Print_ISBN
    978-89-950038-8-6
  • Electronic_ISBN
    978-89-962150-0-4
  • Type

    conf

  • DOI
    10.1109/ICSMA.2008.4505556
  • Filename
    4505556