DocumentCode
3337945
Title
Delay Analysis of VLSI Interconnections Using the Diffusion Equation Model
Author
Kahng, Andrew B. ; Muddu, Sudhak Ar
Author_Institution
UCLA Computer Science Department, Los Angeles, CA
fYear
1994
fDate
6-10 June 1994
Firstpage
563
Lastpage
569
Abstract
The traditional analysis of signal delay in a transmission line begins with a lossless LC representation, which yields a wave equation governing the system response; 2-port parameters are typically derived and the solution is obtained in the transform domain. In this paper, we begin with a distributed RC line model of the interconnect and analytically solve the resulting diffusion equation for the voltage response. A new closed form expression for voltage response is obtained by incorporating appropriate boundary conditions for interconnect delay analysis. Calculations of 50% and 90% delay times for various cases of interest (e.g., open-ended RC line) give substantially different estimates from those commonly cited in the literature, thus suggesting revised delay estimation methodologies and intuitions for the design of VLSI interconnects. The discussion furthermore provides a unifying treatment of the past three decades of RC interconnect delay analyses.
Keywords
Boundary conditions; Delay estimation; Partial differential equations; Propagation delay; Propagation losses; Signal analysis; Transforms; Transmission lines; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation, 1994. 31st Conference on
ISSN
0738-100X
Print_ISBN
0-89791-653-0
Type
conf
DOI
10.1109/DAC.1994.204167
Filename
1600440
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