Evaluation of short pulse thermal transient measurements

Author

Székely, V.

Author_Institution

Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest

fYear

2008

fDate

24-26 Sept. 2008

Firstpage

20

Lastpage

25

Abstract

Thermal transient recording and the time constant spectrum analysis are widely used methods in the testing and qualification of IC packages. A limitation of these methods is that recording of the complete transient response requires long time. The paper offers algorithms to evaluate short pulse and short time measurements. These methods are suitable if only the extraction of the short time constants are needed. This is the case if the transient method is used for die attach quality checking.

Keywords

integrated circuit packaging; integrated circuit testing; spectral analysis; transient response; IC package testing; die attach quality checking; short pulse thermal transient measurements; thermal transient recording; time constant spectrum analysis; transient response; Cooling; Integrated circuit packaging; Integrated circuit testing; Power measurement; Pulse measurements; Qualifications; Steady-state; Thermal resistance; Time measurement; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on

Conference_Location

Rome

Print_ISBN

978-1-4244-3365-0

Electronic_ISBN

978-2-35500-008-9

Type

conf

DOI

10.1109/THERMINIC.2008.4669872

Filename

4669872