• DocumentCode
    3339543
  • Title

    VLSI interconnect modeling at multi-GHz frequencies incorporating inductance

  • Author

    Zadpour, M. A A ; Kalkur, T.S.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
  • fYear
    2003
  • fDate
    23-25 Feb. 2003
  • Firstpage
    54
  • Lastpage
    59
  • Abstract
    Due to decreasing device sizes and increasing clock speed, the interconnect delay is the dominant factor in clock skew. This delay has been extracted as the RC component in available EDA tools. In this paper, we model the interconnect as RLC components for systems running at multi-GHz clock speeds. A static extraction analysis method, optimized for VLSI, is detailed which considers all the lines within the vicinity of the target line as return paths. Novel formulas are presented for parallel and series RLC circuit reduction. Results characterization and future research areas are also discussed.
  • Keywords
    RLC circuits; VLSI; circuit CAD; inductance; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; logic CAD; CAD tools; EDA tools; RLC components; VLSI interconnect modeling; VLSI optimized extraction method; clock nets; clock skew; clock speed; delay RC component; device sizes; inductance; interconnect delay extraction; parallel RLC circuit reduction; return path lines; series RLC circuit reduction; static extraction analysis; target line; Clocks; Data mining; Delay; Frequency; Impedance; Inductance; Integrated circuit interconnections; Springs; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed-Signal Design, 2003. Southwest Symposium on
  • Print_ISBN
    0-7803-7778-8
  • Type

    conf

  • DOI
    10.1109/SSMSD.2003.1190396
  • Filename
    1190396