Silicon integrated vapor chamber equipped with integrated sensor network for in-situ thermal monitoring and cooling optimization

This contribution concerns an original solution concerning the integration of temperature and pressure sensors in a vapor chamber heat spreader for in-situ monitoring and optimization. The cooling systems integrated in the substrate of the electronic devices are providing a high robustness, offering a high heat conduction coefficient and the opportunity of local sensor integration using CMOS compatible process. Their measurement accuracy related to the proximity to the vapor chamber makes this approach a good tool for heat spreader optimization, as the dissipated heat flux strongly depends on several parameters. A prototype of the heat spreader with integrated temperature and pressure microsensors is presented. Simulation results as well as experimental results of the temperature distribution in a closed vapor chamber are presented.