• DocumentCode
    3341043
  • Title

    Tracking of epoxy/MgO nanocomposites under DC Stress

  • Author

    Yaguang Guo ; Du, B. ; Liu, Yanbing ; Tian, L.

  • Author_Institution
    Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin, China
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    884
  • Lastpage
    887
  • Abstract
    Epoxy/MgO nanocomposites were obtained by mixing nano-MgO particles into neat epoxy with filler loading of 1, 3, 5, 7 wt%. To study the effects of nano-particle content on the tracking failure under dc stress, tracking experiments were carried out. The dc resistance to tracking failure, tracking process and discharge current were measured in relation with the content and the applied voltage. The results show that when the filler content increases from 0 to 5 wt%, the number of drops to tracking failure rises and the erosion depth declines. But the reverse varying tendency happens when the content continue to increase from 5 to 7 wt%. With the purpose of reflecting the underlying mechanism in the tracking failure affected by the nano particles, the recurrent plot technique was applied to reveal the nonlinear characteristics of discharge currents. Finally, the experimental results suggest that the tracking resistance of epoxy can be improved by nano-MgO particles. The best results were obtained with the filler content of 5 wt%.
  • Keywords
    epoxy insulation; erosion; filled polymers; magnesium compounds; nanocomposites; nanoparticles; Epoxy-MgO nanocomposite tracking; MgO; dc resistance; dc stress; discharge current; erosion; filler loading; nanoparticle; nonlinear characteristics; recurrent plot technique; Degradation; Discharges (electric); Electrodes; Insulation life; Nanocomposites; Resistance; Surface discharges; dc voltage; discharge current; discharge distribution; epoxy; nano-MgO particles; nanocomposite; tracking failure; tracking pattern;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619727
  • Filename
    6619727