DocumentCode
3341603
Title
Degradation behaviour of solid insulation under cryogenic conditions
Author
Truong, L. ; Lewin, P.L.
Author_Institution
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
640
Lastpage
643
Abstract
The increasing applications of High Temperature Superconductors (HTS) require the understanding of dielectric behavior at cryogenic temperature. Liquid dielectrics such as liquid nitrogen (LN2) have the ability to recover after discharges provided that efficient cooling is available. However, partial discharge streamers during the pre-breakdown phenomena in LN2 can significantly erode solid insulation. This damage is irreversible and degrades the solid dielectric, therefore, affecting the reliability of insulation system. The paper investigates the erosion phenomena of cryogenic solid dielectrics caused by partial discharges in LN2 under AC applied voltages. The experiment set-up consists of a sharp tungsten point and a solid insulation barrier on top of a planar electrode. The materials investigated were polytetrafluoroethylene (PTFE) and glass fiber reinforced plastic (GRP). Partial discharges were measured during the tests following IEC 60720 standard and streamer channels were recorded using a high speed camera. Different erosion behavior was found for the two types of materials under study. Damage to the PTFE samples appeared only on the surface while erosion of GRP sample was found in form of a hole of which depth increased over time.
Keywords
cooling; cryogenic electronics; dielectric liquids; dielectric properties; electrodes; glass fibre reinforced plastics; high-temperature superconductors; partial discharges; reliability; GFRP; HTS; PTFE; cooling; cryogenic conditions; degradation behaviour; dielectric behavior; glass fiber reinforced plastic; high temperature superconductors; liquid dielectrics; partial discharge; planar electrode; polytetrafluoroethylene; reliability; solid insulation; Cryogenics; Degradation; Dielectrics; Insulation; Partial discharges; Solids; High temperature superconducting; degradation; partial discharges;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location
Bologna
ISSN
2159-1687
Print_ISBN
978-1-4799-0807-3
Type
conf
DOI
10.1109/ICSD.2013.6619753
Filename
6619753
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