• DocumentCode
    3346309
  • Title

    Wafer-Level Packaging of MEMS Accelerometers with Through-Wafer Interconnects

  • Author

    Yun, C.H. ; Brosnihan, T.J. ; Webster, W.A. ; Villarreal, J.

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    320
  • Lastpage
    323
  • Keywords
    Accelerometers; Electronics packaging; Etching; Fabrication; Integrated circuit interconnections; Micromechanical devices; Oxidation; Resists; Wafer bonding; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441285
  • Filename
    1441285
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346309