Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation

Author

Leib, Jürgen ; Mund, Dietrich ; Töpper, Michael

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

562

Lastpage

565

Keywords

Dielectric materials; Etching; Glass; Packaging; Passivation; Plasma temperature; Polymers; Sealing materials; Silicon; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

DOI

10.1109/ECTC.2005.1441323

Filename

1441323

Link To Document