• DocumentCode
    3347351
  • Title

    Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder

  • Author

    Tsai, Iting ; Tai, Li Jung ; Yen, S.F. ; Chuang, T.H. ; Lo, Robert ; Ku, Terry ; Wu, Enboa

  • fYear
    2005
  • fDate
    31 May-3 June 2005
  • Firstpage
    687
  • Lastpage
    691
  • Keywords
    Copper; Environmentally friendly manufacturing techniques; Intermetallic; Lead compounds; Material properties; Materials science and technology; Mechanical factors; Semiconductor thin films; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441343
  • Filename
    1441343
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3347351