Application of Gold-Tin Solder Paste for Fine Parts and Devices

Author

Ishikawa, Masayuki ; Sasaki, Hayato ; Ogawa, Satoko ; Kohinata, Masayoshi ; Mishima, Akifumi ; Yoshida, Hideaki

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

701

Lastpage

709

Keywords

Assembly; Costs; Gold; Lead; Packaging; Printing; Production; Sealing materials; Thermal conductivity; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

DOI

10.1109/ECTC.2005.1441346

Filename

1441346

Link To Document