DocumentCode

3347911

Title

Nano-Composite Lead-Free Interconnect and Reliability

Author

Doraiswami, Ravi ; Tummala, Rao

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

871

Lastpage

873

Keywords

Assembly; Environmentally friendly manufacturing techniques; Fabrication; Flip chip; Lead; Magnetic properties; Mechanical factors; Nanoparticles; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441375

Filename

1441375