Experiment on saw mark at the wafer´s entrance of machining monocrystalline silicon by wire saw

The paper introduces the experiment of the saw mark of wafers´ entrance adopting Taguchi method when machining the monocrystalline silicon ingots by wire saw. Saw mark is the most serious factor and lead the wafer to be rejected. The goal of the experiment is to find the optimal parameters to reduce the ratio of bad wafers. From the data, it is deduced the main factor is feed speed. Following this is wire speed. The minor factor among three factors is slurry flow. Secondly, the optimal combination of each parameter is obtained. Thirdly, the trend of each factor shows the range of optimal parameters. So the experiments provide a lot useful reference to reduce the ratio of the saw mark.