• DocumentCode
    3351153
  • Title

    W-deposited contacts with carbon nanofiber using focused ion and electron beams

  • Author

    Maeda, Shusaku ; Yamada, Toshishige ; Whilhite, Patrick ; Yabutani, Hisashi ; Saito, Tsutomu ; Yang, Cary Y.

  • Author_Institution
    Center for Nanostruct., Santa Clara Univ., Santa Clara, CA, USA
  • fYear
    2010
  • fDate
    12-15 Oct. 2010
  • Firstpage
    125
  • Lastpage
    127
  • Abstract
    Carbon nanofiber (CNF) is promising as a next-generation on-chip interconnect material. Understanding the temperature dependence of CNF resistance is important in evaluating its potential for such interconnect applications. In a CNF test device, contacts formed by tungsten (W) deposition using focused ion beam (FIB) is effective in minimizing the effect of unwanted parasitics, thus yielding a more accurate determination of the temperature dependence. However, FIB deposition can potentially damage devices because of its high energy. We propose to use a gas-injection system for low-energy electron-beam deposition with fine precision in a variable-pressure scanning electron microscope. The results of W-deposited CNF devices obtained using electron beam (e-beam) are compared with their FIB counterparts.
  • Keywords
    carbon fibres; electron beam deposition; focused ion beam technology; integrated circuit interconnections; nanostructured materials; scanning electron microscopes; tungsten; W; carbon nanofiber; electron beam deposition; focused ion beam; gas-injection system; next-generation on-chip interconnect material; temperature dependence; variable-pressure scanning electron microscope; Conductivity; Current measurement; Electrodes; Geographic Information Systems; Gold; Temperature; Temperature measurement; Carbon nanofiber; FIB; e-beam-induced deposition; electrothermal transport;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-8896-4
  • Type

    conf

  • DOI
    10.1109/NMDC.2010.5652503
  • Filename
    5652503