Integration of costing, yield and performance metrics into the TCAD environment through the combination of DOE and RSM

Author

Fallon, M. ; Walton, A.J. ; Newsam, M.I. ; Axelrad, V. ; Granik, Y.

Author_Institution

Dept. of Electr. Eng., Edinburgh Univ., UK

fYear

1995

fDate

17-19 Sep 1995

Firstpage

266

Lastpage

270

Abstract

This paper details a procedure that uses a Total TCAD framework for producing costing and yield response surfaces in addition to the normal performance related information. It uses CALPHURNIA to integrate the simulation and experimental design software into the same environment. In addition to the transfer of data between the two packages, CALPHURNIA also automates the fitting of response surfaces and the creation of response distribution information for the design of robust processes. CAESAR is used to manage the process, device and circuit simulators while RS/1 performs the experimental design role. The costing and yield information is held as formulas within RS/1 which, when combined with the process details, can produce response surfaces of cost information that can be used to help the process designer select the most appropriate operating region

Keywords

CAD; costing; design for manufacture; design of experiments; economics; integrated circuit manufacture; integrated circuit yield; semiconductor process modelling; CAESAR; CALPHURNIA; DOE; RS/1; RSM; Total TCAD; costing; data transfer; experimental design; performance metrics; response surface methodology; semiconductor manufacturing; simulation; software packages; yield; Circuit simulation; Costing; Costs; Design for experiments; Measurement; Packaging; Process design; Response surface methodology; Robustness; Surface fitting;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on

Conference_Location

Austin, TX

Print_ISBN

0-7803-2928-7

Type

conf

DOI

10.1109/ISSM.1995.524405

Filename

524405