DocumentCode
3353212
Title
Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black
Author
MA, Peng Cheng ; ZHANG, Hao ; WANG, Sheng Qi ; WONG, Yiu Kei ; Tang, Ben Zhong ; Hong, Soon Hyung ; Paik, Kyung-Wook ; Kim, Jang-Kyo
Author_Institution
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
fYear
2007
fDate
19-22 Nov. 2007
Firstpage
1
Lastpage
4
Abstract
Nanocomposites reinforced with hybrid fillers of carbon nanotube (CNT) and carbon black (CB) were developed, aiming at enhancing the electrical conductivity of the composites with balanced mechanical properties while lowing the cost of the final product. Epoxy-based nanocomposites were successfully prepared with varying combinations of CNT and CB as conductive fillers and their electrical and mechanical properties were evaluated. It was shown that adding CB in CNT composites can enhance the electrical conductivity of the composites: a low percolation threshold was achieved with 0.20 wt% CNTs and 0.20 wt% of CB. CB enhanced the ductility of the nanocomposites, confirming the synergic effect of CB as an effective multi-functional filler. Flexural modulus and strength were remained at around 3.30 GPa and 110 MPa, respectively, between the composites containing CNT only and those filled with hybrid fillers. The implications of the findings are discussed regarding practical applications of the composites as the thermal interface material for electronics packaging.
Keywords
bending strength; carbon nanotubes; ductility; elastic moduli; electrical conductivity; filled polymers; nanocomposites; percolation; C; carbon black; carbon nanotubes; ductility; electrical conducting behavior; electrical properties; electronics packaging; epoxy-based nanocomposites; flexural modulus; flexural strength; hybrid fillers reinforced nanocomposites; mechanical properties; percolation threshold; thermal interface material; Carbon nanotubes; Chemical technology; Composite materials; Conducting materials; Conductivity; Costs; Electronic packaging thermal management; Materials science and technology; Mechanical factors; Nanocomposites;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location
Daejeon
Print_ISBN
978-1-4244-1909-8
Electronic_ISBN
978-1-4244-1910-4
Type
conf
DOI
10.1109/EMAP.2007.4510279
Filename
4510279
Link To Document