Enabling recipe automation for non SECS/GEM semiconductor assembly machines.

Author

Meng, Heong Chee ; Sani, Amin Mohd

Author_Institution

ON Semicond., Seremban

fYear

2007

fDate

19-22 Nov. 2007

Firstpage

1

Lastpage

7

Abstract

In today´s semiconductor manufacturing, recipe is a very important portion of the machine system. With that in mind, there is a huge demand to enable recipe automation. Recipe automation here basically covers the download and upload of a process program. The download refers to downloading from the host to the machine, while the upload is referring to transfer of process program from the machine to the host. For a non-SECS/GEM machine (i.e., one that does not support communication to the host) this will be a challenge. The main objective of performing recipe automation is to ensure that the correct recipe is being used during the bonding process. With this, we can eliminate mis-processing that is due to loading the wrong recipe.

Keywords

assembling; computerised control; process control; semiconductor device manufacture; SECS/GEM interface; SEMI equipment communications standard/generic equipment model; equipment-to-host communications; process control; recipe automation; semiconductor assembly machines; semiconductor manufacturing; Assembly; Automatic control; Bonding processes; Costs; Humans; Manufacturing automation; Manufacturing industries; Read-write memory; Semiconductor device manufacture; Sockets;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on

Conference_Location

Daejeon

Print_ISBN

978-1-4244-1909-8

Electronic_ISBN

978-1-4244-1910-4

Type

conf

DOI

10.1109/EMAP.2007.4510283

Filename

4510283