• DocumentCode
    3353710
  • Title

    A Study on Improvement of Strength by using Photopolymer Resin in the 3DP Process

  • Author

    Kim, Dong Soo ; Lee, Won Hee ; Kim, Jung Su ; Lee, Min Cheol

  • Author_Institution
    Inst. of Machinery & Mater., IT Machinery Res. Center Korea, Daejeon
  • Volume
    4
  • fYear
    2006
  • fDate
    9-13 July 2006
  • Firstpage
    2990
  • Lastpage
    2995
  • Abstract
    3DP (three dimensional printing) technology is one of SFF (solid freeform fabrication) technologies which have recently come into a spotlight due to its adaptability to various applications. This technology has a great advantage of enabling high speed printing to be done on the basis of the ink-jet technology and the system to be constructed at a low cost. However, it has also the disadvantage of requiring a curing time after solid freeform fabrication and in additionally a post-processing process is inevitably to increase the mechanical strength of the product. In this study, a novel 3DP process is proposed to overcome slow solidification and elaborate post-process by adopting photocuring method into the conventional 3DP process. Mechanical properties, such as tensile and bending strengths, of specimens fabricated with the proposed 3DP process were measured and compared with those fabricated with the conventional 3DP process. As a result, it is found that mechanical strengths of specimens from the proposed novel 3DP process show three times higher than those from the conventional 3DP process. Besides, the overall fabrication time with the proposed novel 3DP process is about two times faster than that with the conventional 3DP process, because it does not need additional curing and post-processing time
  • Keywords
    digital printing; ink jet printers; mechanical strength; optical polymers; resins; ink-jet technology; mechanical strength; photocuring method; photopolymer resin; post-processing process; solid freeform fabrication technologies; three dimensional printing technology; Costs; Curing; Laser sintering; Optical device fabrication; Powders; Printing; Resins; Solids; Tellurium; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2006 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    1-4244-0496-7
  • Electronic_ISBN
    1-4244-0497-5
  • Type

    conf

  • DOI
    10.1109/ISIE.2006.296092
  • Filename
    4078868