• DocumentCode
    3359306
  • Title

    Improving Transition Fault Test Pattern Quality through At-Speed Diagnosis

  • Author

    Tendolkar, Nandu ; Belete, Dawit ; Schwarz, Bill ; Podnar, Bob ; Gupta, Akshay ; Karako, S. ; Cheng, Wu-Tung ; Babin, Alex ; Tsai, Kun-Han ; Tamarapalli, Nagesh ; Aldrich, Greg

  • fYear
    2006
  • fDate
    Oct. 2006
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    As electronic design feature sizes continue to shrink and clock speeds continue to rise, more and more companies have turned to at-speed test techniques to help ensure high test and product quality. Due to incomplete timing information during automatic test pattern generation (ATPG), it is possible that some at-speed patterns may activate paths which are not required to meet system speed, and these patterns may fail during production test. It is often difficult and time consuming to identify these paths manually. This paper describes how to use diagnosis techniques to automatically identify these paths. Using this approach, the authors found most of these paths were false or multicycle paths inside DFT logic. These could be fixed by enhancing the timing exception paths used during ATPG to mask out transition values through these paths. Elimination of these paths resulted in a 300 MHz increase in the speed of the transition fault test pattern. However, occasionally the authors did find some failing paths were real functional problems and design changes were needed to resolve them
  • Keywords
    automatic test pattern generation; design for testability; electronic design automation; fault diagnosis; ATPG; DFT logic; at-speed diagnosis; automatic test pattern generation; clock speeds; diagnosis techniques; product quality; time consuming; transition fault test pattern quality; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Delay; Electronic equipment testing; Fault diagnosis; Semiconductor device testing; System testing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2006. ITC '06. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    1-4244-0292-1
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2006.297623
  • Filename
    4079301