DocumentCode
3359835
Title
Pattern Pruner: Automatic Pattern Size Reduction Method that Uses Computational Intelligence-Based Testing
Author
Hong, Eric Liau Chee ; Menke, Manfred ; Janik, Thomas ; Schmitt-Landsiedel, Doris
Author_Institution
Infineon Technol. AG, Neubiberg
fYear
2006
fDate
Oct. 2006
Firstpage
1
Lastpage
10
Abstract
This paper describes a novel computational intelligence test method with automatic pattern size reduction algorithm - Pattern Pruner for improving the efficiency of localization for the design weaknesses and/or faults using state-of-art automatic test equipment (ATE). Computational intelligence and Pattern Pruner software implemented on semiconductor automatic test equipment allows finding worst case test pattern and identifying design weaknesses. This is demonstrated by detection of a hang-up in a pseudo-SRAM test chip with asynchronous operation and hidden refresh, package parasitics are found to be the cause of the failure, and debugging is performed by modification of the power network
Keywords
SRAM chips; artificial intelligence; automatic test equipment; automatic test pattern generation; automatic test software; fault simulation; integrated circuit testing; Pattern Pruner; automatic pattern size reduction; automatic test equipment; computational intelligence testing; fault localization; pseudo-SRAM test chip hang-up; semiconductor automatic test; Algorithm design and analysis; Automatic test equipment; Automatic testing; Competitive intelligence; Computational intelligence; Debugging; Packaging machines; Semiconductor device packaging; Semiconductor device testing; Software testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2006. ITC '06. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
1-4244-0292-1
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2006.297653
Filename
4079331
Link To Document