Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis

Author

Takasu, Yoshiyuki ; Kikuchi, Katsuya ; Nakagawa, Hiroshi ; Koshiji, Kohji ; Aoyagi, Masahiro

Author_Institution

NeRI, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2009

fDate

2-4 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.

Keywords

crosstalk; electric impedance; electromagnetic fields; printed circuits; 3D electromagnetic field analysis; 3D electromagnetic field simulation; characteristic impedance control; coaxial bend; connection structures; high-speed signal transmission; low crosstalk; printed circuit boards; rectangular coaxial line structure; simulated high-frequency characteristics; Analytical models; Circuit simulation; Coaxial components; Crosstalk; Distributed parameter circuits; Electromagnetic analysis; Electromagnetic fields; Impedance; Microstrip; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Conference_Location

Shatin, Hong Kong

Print_ISBN

978-1-4244-5350-4

Electronic_ISBN

978-1-4244-5351-1

Type

conf

DOI

10.1109/EDAPS.2009.5403985

Filename

5403985