Filter integration in ultra thin organic substrate via 3D stitched capacitor

Author

Min, Sunghwan ; Hwang, Seunghyun ; Chung, Daehyun ; Swaminathan, Madhavan ; Sridharan, Vivek ; Chan, Hunter ; Liu, Fuhan ; Sundaram, Venky ; Tummala, Rao R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2009

fDate

2-4 Dec. 2009

Firstpage

1

Lastpage

4

Abstract

This paper presents filters integrated in ultra thin multilayer organic substrate using 3D stitched capacitor alleviating shunt parasitics and providing tunable capacitors. Insertion loss of less than 2.2 dB, return loss of greater than 15 dB at 2.4 GHz and attenuation of greater than 30 dB below 2.0 GHz and at 4.7 GHz were measured. The measured results showed good agreement with simulated results. This paper demonstrated 2.4 GHz bandpass filters with size of 2.2 mm Ã— 3.0 mm Ã— 0.2 mm (1.2 mm³) in ultra thin organic RXP substrate.

Keywords

ceramic capacitors; printed circuit manufacture; substrates; system-on-package; 3D stitched capacitor; bandpass filters; filter integration; frequency 2.4 GHz; frequency 4.7 GHz; ultra thin organic substrate; Capacitors; Dielectric materials; Dielectric substrates; Electronics packaging; Filters; Magnetic materials; Radio frequency; Semiconductor device packaging; Temperature; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Conference_Location

Shatin, Hong Kong

Print_ISBN

978-1-4244-5350-4

Electronic_ISBN

978-1-4244-5351-1

Type

conf

DOI

10.1109/EDAPS.2009.5404004

Filename

5404004