• DocumentCode
    3360513
  • Title

    Microelectronics for the real world: “Moore” versus “More than Moore”

  • Author

    Kent, John P. ; Prasad, Jagdish

  • Author_Institution
    ON Semicond., Pocatello, ID
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    395
  • Lastpage
    402
  • Abstract
    Memories and microprocessors improvements rely on the continued scaling in silicon based CMOS technologies known as ldquoMoorepsilasrdquo law. However, new classes of products are emerging that provide additional value based on functional innovation and diversification instead of scaling. This functional diversification is being called ldquoMore-than-Moorerdquo. Product innovation in ldquoMore-than-Moorerdquo technologies is differentiated by circuit design, architecture, embedded software and unique process technology. These innovations enable the use of older, proven technologies in highly reliable products. This approach allows for non-digital functions such as RF, power control, passive components, sensors and actuators to migrate from the system board level into a package level (SiP) or chip level (SoC) implementation. The objective of ldquoMore-than-Moorerdquo is to incorporate digital and non-digital functionality into compact systems. ldquoMore-than-Moorerdquo technologies are application specific and focus on the interface between the ldquoAnalogrdquo and the digital world. In this paper we will discuss the applications of ldquoMore-than-Moorerdquo concept and its utility in real life.
  • Keywords
    CMOS integrated circuits; microprocessor chips; CMOS technologies; More-than-Moore; chip level; embedded software; functional diversification; microelectronics; product innovation; system board level; CMOS technology; Circuit synthesis; Computer architecture; Embedded software; Microelectronics; Microprocessors; Power system reliability; Radio frequency; Silicon; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2018-6
  • Electronic_ISBN
    978-1-4244-2019-3
  • Type

    conf

  • DOI
    10.1109/CICC.2008.4672103
  • Filename
    4672103