DocumentCode
3362
Title
Experiments and Numerical Simulations on Local Degradation Characteristics of Coated Conductor Due to Overcurrent
Author
Xudong Wang ; Tao Wang ; Ishiyama, Atsushi ; Yagi, Masashi ; Maruyama, Osamu ; Ohkuma, Takeshi
Author_Institution
Dept. of Electr. Eng. & Biosci., Waseda Univ., Tokyo, Japan
Volume
23
Issue
3
fYear
2013
fDate
Jun-13
Firstpage
8002205
Lastpage
8002205
Abstract
Coated conductors are subjected to short-circuit currents 10 to 30 times greater than the operating current in the use of superconducting power cables. The Ic and thickness of the stabilizer are considered to be nonuniformly distributed in the real manufacturing process. Thus, the coated conductor may be damaged locally by the hot spot due to the overcurrent. Therefore, it is important to clarify the local degradation characteristics of the coated conductor and determine its tolerance against the fault current in the actual operation. In a previous study, overcurrent experiments and numerical simulations on thermal stress-strain were carried out on a coated conductor with a nonuniformly distributed Ic. In this study, two samples with nonuniformly distributed copper plating thickness were tested. Numerical simulations based on the finite element method were performed to simulate the temperature and thermal stress-strain distribution caused by the overcurrent. The nonuniform thickness of the copper plating and the longitudinal length of the nonuniform area were considered as the simulation parameters.
Keywords
copper; finite element analysis; high-temperature superconductors; short-circuit currents; stress-strain relations; superconducting cables; Cu; coated conductor; fault current; finite element method; hot spot; local degradation characteristics; overcurrent; short circuit current; stabilizer; superconducting power cables; thermal stress-strain distribution; tolerance; Conductors; Copper; Degradation; Integrated circuits; Temperature measurement; Thermal stresses; Yttrium barium copper oxide; Degradation; finite element method; short circuit current; thermal stress;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2013.2238592
Filename
6407834
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