• DocumentCode
    3363319
  • Title

    Flexible printed two-element antenna array with enhanced isolation performance

  • Author

    Jun Wu Zhang ; Kye Yak See ; Eng Kee Chua

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2013
  • fDate
    11-13 Dec. 2013
  • Firstpage
    369
  • Lastpage
    372
  • Abstract
    A 3D compact antenna array printed on package was proposed for RF powered battery-less device operating at 900MHz. The array-integrated package has size of 33 mm by 56 mm by 12 mm, whose largest dimension is only 0.2λ at 900 MHz. Each radiating element is connected to a circuitry on PCB through inductive coupling and hence no direct electrical contact between PCB and the package is needed, which greatly simplifies the assembly process. An isolation structure is added to minimize the coupling between closely spaced array elements. The prototype was fabricated by printing the antenna array on 0.1 mm thick PET sheet and by folding the sheet into a rectangular package. A maximum isolation of 30 dB between the two array elements was demonstrated for the proposed design. The measured radiation pattern also reveals the importance of the isolation component. It shows maximum gain of 1.1 dBi and 0.7 dBi is achieved for each array element of the proposed design, which is significantly higher than that of the reference design without any isolation.
  • Keywords
    antenna radiation patterns; electronics packaging; microstrip antenna arrays; printed circuits; 3D compact antenna array; PCB; PET sheet; RF powered battery-less device; array-integrated package; assembly process; closely spaced array elements; enhanced isolation performance; flexible printed two-element antenna array; frequency 900 MHz; inductive coupling; isolation component; isolation structure; radiating element; radiation pattern; rectangular package; size 0.1 mm; Conferences; Decision support systems; Electronics packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-2832-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2013.6745744
  • Filename
    6745744