DocumentCode
3363319
Title
Flexible printed two-element antenna array with enhanced isolation performance
Author
Jun Wu Zhang ; Kye Yak See ; Eng Kee Chua
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2013
fDate
11-13 Dec. 2013
Firstpage
369
Lastpage
372
Abstract
A 3D compact antenna array printed on package was proposed for RF powered battery-less device operating at 900MHz. The array-integrated package has size of 33 mm by 56 mm by 12 mm, whose largest dimension is only 0.2λ at 900 MHz. Each radiating element is connected to a circuitry on PCB through inductive coupling and hence no direct electrical contact between PCB and the package is needed, which greatly simplifies the assembly process. An isolation structure is added to minimize the coupling between closely spaced array elements. The prototype was fabricated by printing the antenna array on 0.1 mm thick PET sheet and by folding the sheet into a rectangular package. A maximum isolation of 30 dB between the two array elements was demonstrated for the proposed design. The measured radiation pattern also reveals the importance of the isolation component. It shows maximum gain of 1.1 dBi and 0.7 dBi is achieved for each array element of the proposed design, which is significantly higher than that of the reference design without any isolation.
Keywords
antenna radiation patterns; electronics packaging; microstrip antenna arrays; printed circuits; 3D compact antenna array; PCB; PET sheet; RF powered battery-less device; array-integrated package; assembly process; closely spaced array elements; enhanced isolation performance; flexible printed two-element antenna array; frequency 900 MHz; inductive coupling; isolation component; isolation structure; radiating element; radiation pattern; rectangular package; size 0.1 mm; Conferences; Decision support systems; Electronics packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location
Singapore
Print_ISBN
978-1-4799-2832-3
Type
conf
DOI
10.1109/EPTC.2013.6745744
Filename
6745744
Link To Document