• DocumentCode
    3364755
  • Title

    Three-dimensional vibration analysis of the split electrode vibrator using finite element method

  • Author

    Lin Fu ; Dong Wang ; Xiu-ming Wang

  • Author_Institution
    State Key Lab. of Acoust., Inst. of Acoust., Beijing, China
  • fYear
    2012
  • fDate
    23-25 Nov. 2012
  • Firstpage
    318
  • Lastpage
    321
  • Abstract
    In this paper, ANSYS based on the finite element method is used to investigate the effects of geometry and electrodes of a split thin piezoelectric ceramic strip on its resonant frequencies and conductance related to the sensitivity. Our numerical results show that the fundamental frequencies decrease as the vibrator length and width increase. And it is mainly influenced by the longest dimension of the vibrator. As for the split electrode vibrator, when the electrode area decreases, the resonant frequencies will increase while the conductance decreases. The order of resonant frequencies corresponding to the highest conductance is equal to the number of electrodes in the vibration trip. So the way of splitting electrode can increase the vibrator sensitivity. Our numerical results are in agreement with the existing theoretical result for the simplified model. This work will give some insights for the design of high-frequency and high-performance transducer.
  • Keywords
    electrodes; finite element analysis; piezoceramics; piezoelectric transducers; vibrations; ANSYS finite element method; geometry effect; high-frequency transducer design; high-performance transducer design; resonant frequency; split electrode vibrator; split thin piezoelectric ceramic strip; three-dimensional vibration analysis; vibration trip; vibrator length; vibrator sensitivity; Acoustics; Ceramics; Electrodes; Finite element methods; Resonant frequency; Sensitivity; Vibrations; Conductance; Resonant frequencies; Sensitivity; Split electrode vibrator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2012 Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-4814-0
  • Type

    conf

  • DOI
    10.1109/SPAWDA.2012.6464098
  • Filename
    6464098