DocumentCode
336512
Title
Comparison of evoked potential source localization and functioned MRI in a four-shell ellipsoidal volume conductor
Author
Blimke, John ; Volkmer, H. ; Spilker, Alary ; Myklebust, Joel
Author_Institution
Dept. of Biomed. Eng., Marquette Univ., Milwaukee, WI, USA
Volume
2
fYear
1997
fDate
30 Oct-2 Nov 1997
Firstpage
470
Abstract
A four-shell ellipsoidal model had been developed for EEG and MRI applications, using a multipole expansion in ellipsoidal coordinates. The model provides accurate distribution of potentials and surface current density generated by a dipole placed in the inner most ellipsoid. The dipole can be anywhere in any direction in the ellipsoid. Surface Laplacian data obtained from EEG measurements are fit to the surface current density from each of the models in a least squares sense for comparisons of the resulting dipole locations and orientations. The dipole location estimated from somatosensory evoked potentials is compared to the location of activation in functional MRI experiments using somatosensory stimulation
Keywords
Laplace equations; bioelectric potentials; biomedical MRI; brain models; current density; electroencephalography; interpolation; least squares approximations; medical image processing; medical signal processing; somatosensory phenomena; time series; EEG; accurate distribution of potentials; brain activity; dipole in inner ellipsoid; dipole locations; dipole orientations; ellipsoidal coordinates; evoked potential source localization; four-shell ellipsoidal volume conductor; functioned MRI; least squares; multipole expansion; somatosensory evoked potentials; somatosensory stimulation; surface Laplacian data; surface current density generated; Brain modeling; Current density; Current measurement; Density measurement; Electroencephalography; Ellipsoids; Laplace equations; Least squares methods; Magnetic resonance imaging; Surface fitting;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1094-687X
Print_ISBN
0-7803-4262-3
Type
conf
DOI
10.1109/IEMBS.1997.757646
Filename
757646
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